Cooler Master RR-T612-20PK-R1 Datenblatt

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The TPC 612 uses 2 separate cooling
technologies to transfer heat heat pipes and
vertical vapor chambers.
100% pure polished copper base combined
with improved soldering technologies for the
best thermal transfer.
Special fin design heatsink receives
concentrated cold airflow.
Slim heatsink provides great compatibility for
overclocking memory modules with tall heat
spreader.
Clip-on fan mounting bracket
Universal Mounting support
TPC 612 is the next generation of CPU cooler thanks to
new vertical vapor chamber technology combined with
four 6mm heat pipes. A nickel plated, pure polished
copper base spreads heat into a tall, aluminum alloy
heat sink ensuring optimal cooling. TPC 612 has a
slimmer heatsink than the TPC 812 to support
overclocking memory modules.
CPU Socket
Intel® LGA 2011/1366/1156/1155/775
AMD FM1/AM3+/AM3/AM2+/AM2
Dimensions
145 x 97 x 161.6 mm (5.7 x 3.8 x 6.4 in)
Heat Sink Dimensions
134 x 85 x 161.6 mm (5.3 x 3.4x 6.4 in)
Heat Sink Material
Copper Base / 2 Vapor Chambers
4 Heatpipes / Aluminum Fins
Heat Sink Weight
640g (1.72 lb)
Heat Pipe Dimensions
Ø 6mm
Fan Dimensions
120 x 120 x 25mm (4.7 x 4.7 x 1 in)
Fan Speed
600 ~ 2,000 RPM (PWM) ± 10%
Fan Air Flow
24.9 ~ 82.9 CFM ± 10%
Fan Air Pressure
0.3 ~ 2.7 mm H2O ± 10%
Fan Life Expectancy
40,000 hrs
Noise Level
9 ~ 36 dBA
Bearing Type
Rifle Bearing
Connector
4-Pin
Fan Weight
122g (0.33 lb)
Weight
762g (2.05 lb)
EAN Code
UPC Code
Package Dimensions
Carton Dimensions
Unit / Carton
Carton / Pallet
TPC 612
RR-T612-20PK-R1
2 years
Features
Specifications
Package Information
Warranty
Seitenansicht 0
1 2

Inhaltsverzeichnis

Seite 1 - TPC 612

 The TPC 612 uses 2 separate cooling technologies to transfer heat – heat pipes and vertical vapor chambers.  100% pure polished copper base

Seite 2 - Appendix

Synergy cooling – Vapor chamber + Heatpipe Vertical vapor chamber Pure polished copper base Special fin design Improved fan mounting syst

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